AI07 Model(CC GPT)

{
  "prompt": "<cn><|start_header_id|>user<|end_header_id|>\\n\\n角色：您是专利领域和专利新创性审查的专家，能够对输入的目标文本进行技术特征分解。\\n\\n输入内容：\\n<**目标专利的权利要求**>：'1.一种用于光学装置的陶瓷基板结构，其特征在于，包括:\\n一陶瓷基板，具有一第一表面、一第二表面及多个注胶孔，该第一表面包含多个凹杯成型区、多个固晶区及多个第一金属电路，该第二表面包含多个第二金属电路，各该注胶孔连通该第一表面及该第二表面，并具有位于该第一表面的一第一开口及位于该第二表面的一第二开口，且该第一开口设置在该凹杯成型区；\\n一绝缘层，披覆在该第二表面上，且该绝缘层外露出该些第二金属电路及该第二开口；以及\\n多个承载胶杯，以射出成型方式结合在该些凹杯成型区上，且各该承载胶杯连接该些第一金属电路并包围有一固晶区。\\n2.如权利要求1所述的用于光学装置的陶瓷基板结构，其特征在于，该陶瓷基板更包括多个金属挡环，该些金属挡环成型在该第一表面，并分别位于各该凹杯成型区的周缘。\\n3.如权利要求2所述的用于光学装置的陶瓷基板结构，其特征在于，该些金属挡环为电镀铜所构成。\\n4.如权利要求1所述的用于光学装置的陶瓷基板结构，其特征在于，该绝缘层由防焊漆所构成。\\n5.一种用于光学装置的陶瓷基板结构，其特征在于，包括:\\n一陶瓷基板，具有一第一表面、一第二表面及一注胶孔，该第一表面包含一凹杯成型区、一固晶区及多个第一金属电路，该第二表面包含多个第二金属电路，该注胶孔连通该第一表面及该第二表面，并具有位于该第一表面的一第一开口及位于该第二表面的一第二开口，且该第一开口设置在该凹杯成型区；\\n一绝缘层，披覆在该第二表面上，且该绝缘层外露出该些第二金属电路及该第二开口；以及\\n一承载胶杯，以射出成型方式结合在该凹杯成型区上，且该承载胶杯连接该些第一金属电路并包围有该固晶区。\\n6.如权利要求5所述的用于光学装置的陶瓷基板结构，其特征在于，该陶瓷基板更包括多个金属挡环，该些金属挡环成型在该第一表面，并分别位在各该凹杯成型区的周缘。\\n7.如权利要求6所述的用于光学装置的陶瓷基板结构，其特征在于，该些金属挡环为电镀铜所构成。\\n8.如权利要求5所述的用于光学装置的陶瓷基板结构，其特征在于，该绝缘层由防焊漆所构成。\\n9.一种用于光学装置的陶瓷基板工艺，其特征在于，包括:\\na)提供一陶瓷基板，具有一第一表面、一第二表面及连通该第一表面及该第二表面的一注胶孔；\\nb)对该陶瓷基板进行激光、溅镀、形成金属线路、电镀铜、剥膜蚀刻工艺；\\nc)对该第一表面进行防焊工艺；\\nd)对该第二表面进行防焊工艺；以及\\ne)对该陶瓷基板进行射出成型工艺，以在该第一表面成型有一塑料承杯。\\n10.如权利要求9所述的用于光学装置的陶瓷基板工艺，其特征在于，该第一表面包含一凹杯成型区、一固晶区及多个第一金属电路，该b)步骤中的电镀铜工艺包含在该凹杯成型区的周缘成型多个金属挡环。\\n11.如权利要求9所述的用于光学装置的陶瓷基板工艺，其特征在于，该注胶孔具有位于该第一表面的一第一开口及位于该第二表面的一第二开口，该第二表面包含多个第二金属电路，该d)步骤中的防焊工艺外露出该些金属电路及该第二开口。\\n'\\n\\n任务说明：\\n\\n任务1：分析目标专利的权利要求，并进行技术特征分解\\n    1. 分解逻辑：\\n        a. 逐一分解每个权利要求中的技术特征。\\n        b. 若技术方案中的多处内容彼此紧密联系、相互依存，通过协同作用共同解决同一技术问题、产生独立技术效果，则这些内容应当被分解为一个技术特征。\\n        c. 技术特征可以包括：产品部件、部件之间的连接关系、方法步骤、步骤之间的关系、组成成分和比例及其相互作用等。技术特征可以是构成权利要求技术方案的组成要素，也可以是要素之间的相互关系。\\n        d. 技术特征通常包含对部件和结构的性能/参数/用途/功能/制备方法/效果/逻辑/协同关系等方面的描述，该描述应当与部件/结构合为一整体特征，不可割裂为多个特征，如''随着压帽旋进卡紧器，卡紧器的卡爪收缩咬紧在套管外表面，从而实现了牺牲阳极与套管的连接''，如''固定中心架(1),用于支撑待机械处理''。\\n        e. 权利要求撰写是会使用开放式/封闭式的措词，如：包括、由xx组成，主要由xx构成，组成为 等表述，其对权利要求的保护范围具备实际意义，故不得遗漏表征。\\n        f. 严格确保每个权利要求的主题名称作为独立一个技术特征，如：一种xx的设备/方法。从属权利要求的主题名称通常是使用'权利要求X所述'或类似用语。\\n    2. 分解限定\\n        a. 严格确保目标专利权利要求的所有内容都有所分解，防止遗漏。目标专利的技术特征必须严格遵循权利要求中的描述，技术特征总和即构成权利要求。权利要求的保护范围是由权利要求记载的全部内容作为一个整体限定的。\\n        b. 清楚地识别每个权利要求中技术特征之间的关系，技术特征的拆解必须遵循原文描述，不得增加与原文内容无关的序号和表述，不可随意改写。\\n        c. 忽略权利要求中的“其特征是…”或类似用语。\\n        d. 务必注意层级关系，冒号前的内容要给予保留，如【以下制备过程：】或【所述xx设备包括：】或【包含以下配比：】或【原材料构成：】或【comprising the steps of:】等类似用语，必须单独列出一个单元格。\\n        e. 必须保留权利要求技术特征后面的括号和括号中的内容，不可缺失【所述xx】、【该xx】、【其xx】等名词前的类似代词。\\n        f. 若权利要求原文有较清晰的结构，如通过换行、分号等手段，应尽量遵循原文结构。\\n\\n\\n任务2：生成技术特征分解\\n    1. 输出仅包含技术特征分解的结果。\\n    2. 每个权利要求单独分解需独立在一个key下。\\n    3. 语言与目标权利要求保持一致（例如，目标权利要求为英语，则技术特征分解列的语言为英语）。\\n\\n注意事项：\\n    1、只输出任务2的技术特征分解结果；\\n    2、输出为Markdown格式，包含两列，ID及claim_feature，多个权利要求间使用其编号区分开，如：###claim_1  ###claim_2\\n    例如：\\n###claim_1\\n| ID | claim_feature |\\n|------|------|\\n| 1 | xx |\\n| 2 | xx |\\n| 3 | xx |\\n| 4 | xx |\\n| 5 | xx |\\n| 6 | xx |\\n<|eot_id|><|start_header_id|>assistant<|end_header_id|>\\n\\n</cn><us><|start_header_id|>user<|end_header_id|>\n\nRole: You are an expert in the patent field and patent novelty examination, capable of decomposing technical features from input target texts.\n\nInput Content:\n<**Target Patent Claims**>: '1. A ceramic substrate structure for an optical device, comprising:\na ceramic substrate having a first surface, a second surface, and a plurality of glue injection holes, wherein the first surface comprises a plurality of cup-shaped molding regions, a plurality of die bonding regions, and a plurality of first metal circuits; the second surface comprises a plurality of second metal circuits; each glue injection hole connects the first surface and the second surface, and has a first opening located at the first surface and a second opening located at the second surface, wherein the first opening is disposed in the cup-shaped molding region;\nan insulating layer covering the second surface, wherein the insulating layer exposes the second metal circuits and the second opening; and\na plurality of carrier resin cups combined on the cup-shaped molding regions by injection molding, wherein each carrier resin cup is connected to the first metal circuits and surrounds a die bonding region.\n2. The ceramic substrate structure for an optical device according to claim 1, wherein the ceramic substrate further comprises a plurality of metal barrier rings formed on the first surface and respectively located at the periphery of each cup-shaped molding region.\n3. The ceramic substrate structure for an optical device according to claim 2, wherein the metal barrier rings are made of electroplated copper.\n4. The ceramic substrate structure for an optical device according to claim 1, wherein the insulating layer is made of solder resist.\n5. A ceramic substrate structure for an optical device, comprising:\na ceramic substrate having a first surface, a second surface, and a glue injection hole, wherein the first surface comprises a cup-shaped molding region, a die bonding region, and a plurality of first metal circuits; the second surface comprises a plurality of second metal circuits; the glue injection hole connects the first surface and the second surface, and has a first opening located at the first surface and a second opening located at the second surface, wherein the first opening is disposed in the cup-shaped molding region;\nan insulating layer covering the second surface, wherein the insulating layer exposes the second metal circuits and the second opening; and\na carrier resin cup combined on the cup-shaped molding region by injection molding, wherein the carrier resin cup is connected to the first metal circuits and surrounds the die bonding region.\n6. The ceramic substrate structure for an optical device according to claim 5, wherein the ceramic substrate further comprises a plurality of metal barrier rings formed on the first surface and respectively located at the periphery of each cup-shaped molding region.\n7. The ceramic substrate structure for an optical device according to claim 6, wherein the metal barrier rings are made of electroplated copper.\n8. The ceramic substrate structure for an optical device according to claim 5, wherein the insulating layer is made of solder resist.\n9. A ceramic substrate process for an optical device, comprising:\na) providing a ceramic substrate having a first surface, a second surface, and a glue injection hole connecting the first surface and the second surface;\nb) performing laser, sputtering, metal circuit formation, copper electroplating, and film-stripping etching processes on the ceramic substrate;\nc) performing a solder resist process on the first surface;\nd) performing a solder resist process on the second surface; and\ne) performing an injection molding process on the ceramic substrate to form a plastic carrier cup on the first surface.\n10. The ceramic substrate process for an optical device according to claim 9, wherein the first surface comprises a cup-shaped molding region, a die bonding region, and a plurality of first metal circuits, and the copper electroplating process in step b) comprises forming a plurality of metal barrier rings at the periphery of the cup-shaped molding region.\n11. The ceramic substrate process for an optical device according to claim 9, wherein the glue injection hole has a first opening located at the first surface and a second opening located at the second surface, the second surface comprises a plurality of second metal circuits, and the solder resist process in step d) exposes the metal circuits and the second opening.\n'\n\nTask Description:\n\nTask 1: Analyze the claims of the target patent and decompose the technical features.\n1. Decomposition Logic:\na. Decompose the technical features of each claim one by one.\nb. If multiple contents in the technical solution are closely related and interdependent, jointly solving the same technical problem and producing independent technical effects through synergistic action, these contents should be decomposed as one technical feature.\nc. Technical features may include: product components, connection relationships between components, method steps, relationships between steps, composition and proportions and their interactions, etc. Technical features can be constituent elements of the technical solution of a claim, or the interrelationships between elements.\nd. Technical features typically include descriptions of performance/parameters/uses/functions/preparation methods/effects/logic/synergistic relationships of components and structures. Such descriptions should be integrated with the component/structure as a whole feature and must not be split into multiple features, e.g., \"as the pressure cap screws into the clamp, the clamp's jaws contract and grip the outer surface of the casing, thereby achieving the connection between the sacrificial anode and the casing,\" or \"fixed center frame (1), used to support items to be mechanically processed.\"\ne. Patent claims use open-ended/closed-ended language, such as: comprising, consisting of, mainly consisting of, composed of, etc. These expressions have actual significance for the scope of protection of the claims and must not be omitted.\nf. Strictly ensure that the subject name of each claim is listed as an independent technical feature, e.g., a device/method for xx. The subject name of dependent claims typically uses \"the claim X\" or similar language.\n2. Decomposition Restrictions:\na. Strictly ensure all content of the target patent claims is decomposed without omission. The technical features of the target patent must strictly follow the description in the claims; the sum of technical features constitutes the claim. The scope of protection of a claim is defined by all the content recorded in the claim as a whole.\nb. Clearly identify the relationships between technical features in each claim. The decomposition of technical features must follow the original description and must not add numbering or expressions unrelated to the original content, nor arbitrarily rewrite it.\nc. Ignore \"wherein\" or similar expressions in the claims.\nd. Pay careful attention to hierarchical relationships. Content before a colon must be retained, such as [the following preparation process:] or [the said xx device comprises:] or [comprising the following proportions:] or [raw material composition:] or [comprising the steps of:] and similar expressions, which must be listed as a separate cell.\ne. Parentheses and their content following technical features in the claims must be retained; pronouns such as [said xx], [the xx], [its xx] before nouns must not be omitted.\nf. If the original claim has a clear structure, such as through line breaks or semicolons, the original structure should be followed as closely as possible.\n\nTask 2: Generate the technical feature decomposition.\n1. Output only the results of the technical feature decomposition.\n2. Each claim should be decomposed independently under a separate key.\n3. The language should be consistent with the target claims (e.g., if the target claims are in English, the technical feature decomposition column should also be in English).\n\nNotes:\n1. Only output the technical feature decomposition results of Task 2;\n2. Output in Markdown format, containing two columns: ID and claim_feature. Multiple claims are distinguished by their numbers, e.g.: ###claim_1 ###claim_2\nExample:\n###claim_1\n| ID | claim_feature |\n|------|------|\n| 1 | xx |\n| 2 | xx |\n| 3 | xx |\n| 4 | xx |\n| 5 | xx |\n| 6 | xx |\n<|eot_id|><|start_header_id|>assistant<|end_header_id|></us>",
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    "output": {
      "usage": {
        "input_tokens": 23,
        "total_tokens": 320,
        "output_tokens": 297
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      "status": "finished",
      "content": "根据公开号为CN109213437A的"
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  "error_msg": "The request parameter format is incorrect！"
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