pcb

Calculate PCB via current-carrying capacity using the IPC-2221 standard. A plated via is a hollow copper cylinder whose cross-sectional area is the annular ring of plating: A = pi * (D - t) * t, where D is the drill diameter and t is plating thickness. The IPC-2221 empirical formula I = k * dT^0.44 * A^0.725 (k=0.048) then gives the maximum current for a given temperature rise. Also computes via barrel resistance from copper resistivity (1.724e-6 ohm-cm) and barrel length (board thickness). When a target current is specified, returns how many parallel vias are needed. Essential for power planes, high-current paths, and thermal via arrays. Chain with trace_width to verify both trace and via can handle the same current.

post/api/pcb_via_current

Request

  • Base URL: https://calc.engineer
  • URL: https://calc.engineer/api/pcb_via_current
  • Auth: none declared

Request body

drill_diameter_mmnumber

Via drill hole diameter in millimeters. Common values: 0.2 (microvia), 0.3 (standard), 0.4, 0.6, 0.8, 1.0.

plating_thickness_umnumber

Copper plating thickness on the via barrel wall in micrometers. Standard is 25 um (IPC Class 2). Heavy plating is 50 um (IPC Class 3).

board_thickness_mmnumber

Total PCB board thickness in millimeters. Standard 2-layer is 1.6 mm. Common values: 0.8, 1.0, 1.6, 2.0, 2.4.

temp_rise_cnumber

Allowable temperature rise above ambient in degrees Celsius. IPC-2221 standard uses 10, 20, or 30 C.

target_current_anumber

Optional target current in amperes. When provided, calculates how many parallel vias are needed to carry this current safely.

Response

Computed result for pcb_via_current

toolstring required
versionstring required
computed_atstring date-time required

Changes

No recorded changes to this operation across all 1 revision of this API.