---
title: "Programmatic chip cost estimation."
method: POST
path: "/api/v1/calculate/chip-cost"
tags: ["calculators"]
---

# Programmatic chip cost estimation.

`POST /api/v1/calculate/chip-cost`

## Request

- Base URL: `https://siliconanalysts.com`
- URL: `https://siliconanalysts.com/api/v1/calculate/chip-cost`
- Auth: none required

Programmatic chip cost estimation. Accepts die dimensions, process node, and optional parameters. Returns full cost breakdown including yield, GDPW, and per-unit economics.

## Request body

- object
  - `dieWidth` string: Die width in mm (required)
  - `dieHeight` string: Die height in mm (required)
  - `processNode` string: Foundry node ID (optional, default: tsmc-n5)
  - `waferCost` string: Override wafer cost in USD (optional, uses benchmark if omitted)
  - `packagingType` string: Packaging architecture (optional, default: flip-chip)
  - `packagingCost` string: Override packaging cost in USD (optional)
  - `hbmStacks` string: Number of HBM stacks (optional, default: 0)
  - `hbmCost` string: HBM cost per GB (optional, default: 0)
  - `testCost` string: Test cost per unit in USD (optional, default: 2)
  - `marginTarget` string: Target gross margin percentage (optional, default: 50)
  - `volume` string: Production volume (optional, default: 10000)
  - `energyRegion` string: Fab region for the optional manufacturing-energy adder: texas | ohio | arizona | china | korea | taiwan | germany (optional; adds a conditional `energy` block — SA estimate, scenario delta)
  - `energyFacilityOverhead` string: Apply the ~1.75× facility-overhead multiplier to the energy adder (optional, default: true; only meaningful with energyRegion)
  - `substrate` string: Packaging substrate SCENARIO: wafer-300mm (default, no-op) | panel-310x310 — applies the midpoint of Yole's realistic 20–30% CoPoS panel-savings band to the packaging cost only; silicon GDPW unchanged (SA scenario; TSMC CoPoS pilot ~Jun 2026, MP 2028–29)
  - `kgdTestCoverage` string: Known-Good-Die pre-bond test coverage % (0–100, optional). Returns a `kgdScenario` block: per-die test cost at this coverage vs. the packaged-defect waste it avoids, effective KGD quality, and the cost-minimizing coverage. Informational — never changes the headline cost. Absent = no-op (SA scenario).

## Response `200`

Successful response

- Envelope: Shared response envelope. Endpoint-specific payloads ride in `data`; `meta` carries provenance, freshness, and pagination hints.
  - `success` boolean
  - `data` object
  - `meta` object

---

[API](https://skmtc.dev/siliconanalysts/apis/silicon-analysts-data-api.md) · [All operations](https://skmtc.dev/siliconanalysts/apis/silicon-analysts-data-api/llms.txt) · [OpenAPI document](https://skmtc.dev/siliconanalysts/apis/silicon-analysts-data-api/revisions/6f151fef25c4?raw)